To access documentation for Intel® eASIC™ N3X devices you need a login. Sign in here. password? {{address}} Compare You may compare a maximum of four products at a time. Forgot your Intel Faster time to market and turnaround time than traditional ASICs due to simplified design flow, customization of only a few mask layers, and when feasible no PCB change from base FPGA designs. To learn more about Intel® eASIC™ solutions, please contact us. Intel® eASIC™ device eTools offer a framework for design conversion and validation using a combination of internally developed and industry standard third party tools. password? Don’t have an Intel account? Intel® eASIC™ devices provide fast time-to-deployment of logic, DSP or IO dominated custom devices with ASIC level performance, resulting in reduction of total cost of ownership and power consumption with low up-front Non-Recurring Engineering (NRE). “Intel eASIC devices provide good power and cost benefits for our 5G wireless products and were essential to make a fast transition to meet our low cost and power requirements,” said Duan Xiang Yang, vice president and general manager of Wireless System Architect at ZTE. The low-power and low-cost acceleration solution for vRAN deployments is based on Intel eASIC technology and is sampling to customers. Intel eASIC devices provide fast time-to-deployment of logic, DSP or IO dominated custom devices. The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links. OEMs have peace of mind that as their product succeeds in the market they have a solid path to cost reduction, and hence higher gross profit margins. The Intel® eASIC™ N3XS device family has an optimized architecture that is ideal for logic, DSP, or memory intensive designs and provides greater than one terabit of bandwidth using a combination of 28 Gbps and 16 Gbps high … Intel offers a complete continuum of custom logic solutions and Intel® FPGAs offer fastest time to market, no NRE, and highest flexibility. You may start your design from any Intel® eASIC™ device and then migrate to a cell-based Intel® easicopy™ device. Sign in here. Sign up here for a basic account. Sign in here. The Intel® eASIC™ Device Continuum Intel offers a complete continuum of custom logic solutions and Intel® FPGAs offer fastest time to market, no NRE, and highest flexibility. Structured ASIC Intel® eASIC™ devices provide power and cost reduction from an Intel® FPGA solution with a low NRE. You can easily search the entire Intel.com site in several ways. You can also try the quick links below to see results for most popular searches. In addition, these new Intel® eASIC Diamond Mesa devices incorporate a quad-core Arm® 64-bit hard processor subsystem, which means that these devices can implement control functions as well as digital signal processing (DSP) and networking functions on a … {{/with}} Intel® eASIC™ devices provide fast time-to-deployment of logic, DSP, or IO dominated custom devices. You can easily search the entire Intel.com site in several ways. Intel eASIC devices provide fast time-to-deployment of logic, DSP or IO dominated custom devices. {{> product-card}} In addition to 5G wireless applications, Intel’s next generation structured ASIC devices will target the acceleration and compute needs of data center, embedded, video, industrial, and military/aerospace applications. Using different combinations of Intel® Xeon® processor and logic solutions you can build equipment tailored to unique time to market (TTM), cost, power, volume, performance1 2 3, and flexibility requirements. For more information on the factors that could cause actual results to differ materially, see our most recent earnings release and SEC filings at www.intc.com. Intel increases 5G infrastructure silicon portfolio breadth with the introduction of its Diamond Mesa SoC Capability. {{> product-card}} The broad offering of Intel Xeon CPUs, Intel … Sign up here Sign up here If required, Intel engineers can work to design a package compatible with your existing PCB with minimal or no board changes required. Partnering with Intel ensures that OEMs have low risk cost reduction solutions from pre-production to very high volume production. Intel® easicopy™ devices provide OEMs with a low risk, vital addition to their existing value engineering programs. Clear All The item selected cannot be compared to the items already added to compare. The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links. {{/with}} Se connecter. Intel® easicopy™ devices provide OEMs with a seamless path from Intel® eASIC™ devices to cell-based ASICs, thereby enabling OEMs to further reduce device cost and power consumption and increase performance. Please remove one or more items before adding more. A wealth of fully verified eASIC-ready IP cores from Intel and third party alliance partners. That OEMs have low risk cost reduction solutions from pre-production to very high volume production alliance partners Intel® FPGA with... Selected Intel eASIC devices provide OEMs with a low NRE provide fast time-to-deployment of logic, DSP IO! That OEMs have low risk cost reduction from an Intel® FPGA solution with low! 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